Powerful electronic components can generate a lot of heat. An overheating electronic component wastes energy and is at risk of behaving unpredictably or failing altogether. Consequently, High power electronic device requires efficient thermal management. Hexagonal Borin Nitride (hBN) has high thermal conductivity and stable chemical properties even at a temperature above 1000 degree C. HBN high bandgap limits its application in microelectronic. By functionalization with fluorine, we found that we can make BN a semiconductor, ie decrease its bandgap. This makes fluorinated BN (FBN) a possible candidate for electronic applications, specifically high power electronic devices where heat generation is the greatest issue.
We are exploring to see if FBN has a high thermal conductivity, like its parent hBN.
-Andy